XC7V585T-3FFG1157E

Manufacturer Part Number:

XC7V585T-3FFG1157E

Pbfree Code:

 Yes

Rohs Code:

 Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-1157

Pin Count:

1157

Reach Compliance Code:

compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Manufacturer:

Xilinx

Risk Rank:

5.79

Clock Frequency-Max:

1818 MHz

Combinatorial Delay of a CLB-Max:

0.58 ns

JESD-30 Code:

S-PBGA-B1157

JESD-609 Code:

e1

Length:

35 mm

Moisture Sensitivity Level:

4

Number of CLBs:

45525

Number of Inputs:

600

Number of Logic Cells:

582720

Number of Outputs:

600

Number of Terminals:

1157

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-55 °C

Organization:

45525 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.8 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.35 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.03 V

Supply Voltage-Min:

0.97 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

MILITARY

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

35 mm